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There are no
carbonates to be treated. It
contains no strong chelators. It
is supplied as a liquid
concentrate, which is diluted
with water.
Flash Copper™
produces a fine grained, smooth,
dense and ductile copper
deposit, which is nonporous and
has excellent bonding
properties. The throwing and
covering power of the
non-cyanide process is superior
to cyanide processes. This is
especially evident in barrel
plating. It has uniform low
current density distribution
with excellent micro-throw.
The grain is
smaller than cyanide copper,
which increases the density of
the deposit. This density
provides excellent heat treat
stop off and masking properties.
The fine-grained Flash Copper™
deposit under nickel/chrome
improves the overall corrosion
resistance and helps to throw
the nickel farther into the low
current density areas.
Flash Copper™
produces a softer and more
ductile deposit than cyanide or
acid copper. The soft deposit
imparts improved adhesion and
corrosion resistance and greatly
improved resistance to thermal
shock. It has a high deposit
purity and hence no out-gassing
with subsequent brazing,
soldering or vacuum operations.
Flash Copper™ is
simple and inexpensive to use
because it replenishes the
copper in solution by dissolving
the copper anode and here again
it is a unique product with only
one maintenance additive.
Flash Copper™
Benefits
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One
solution serves as both a
strike and a plate bath.
-
Greater throwing power than
acid copper
-
Eliminates the inherent
dangers of cyanide in the
work place and improves
employee health and safety.
-
Flash
Copper™ has excellent bath
stability and high
efficiency. The bath does
not have to be dumped as
with other baths due to
breakdown products or iron
buildup.
-
The
bath is easily maintained by
monitoring the pH and copper
metal concentration.
-
It has
a very wide operating
window.
-
Flash
Copper™ is supplied as a
liquid concentrate, which is
diluted with an equal amount
of distilled water.
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